| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a thermoconductive silicone grease composition suppressing liquid dripping, excellent in workability, and exhibiting good thermal conductivity, and a semiconductor device using it. <P>SOLUTION: This thermoconductive silicone grease composition comprises (A) 100 pts.wt. of dimethylpolysiloxane having viscosity at 23°C of 0.05-10 Pa s, and all organic groups linking to silicon atoms are methyl groups, and (B) 500-2,000 pts.wt. of thermoconductive filler. The thermoconductive silicone grease has viscosity at 23°C of ≤400 Pa s, and thermoconductivity of ≥2.0 W/(m×K). <P>COPYRIGHT: (C)2009,JPO&INPIT |
