DISPOSITIF POUR DEGAGER D'UNE PLAQUE-SUPPORT UN ELEMENT FONCTIONNEL DE FAIBLES DIMENSIONS

摘要

A device or tool for removing a component of small dimensions from a carrier plate or circuit board which component is connected to the carrier plate by connecting elements which project through openings in the carrier plate and are attached to conductors thereon by solder joints characterized by a tong-like tool having a heating head mounted on one leg of the tool and a gripping head, which has spaced pairs of gripping elements being rotatably mounted on the other leg to present a selected pair of gripping elements in an operable arrangement with the heating head. A spring biased member is associated with each pair of gripping elements. The spring biased member engages the carrier plate and urges the housing and component engaged by the gripping elements away from the carrier plate to withdraw the connecting elements from the opening as the solder joints are melted or liquefied by the heating head. Preferably, the spring biased members of each of the separate pairs of gripping elements are aligned so that a single compression spring urges both of the members to the outermost position. The housing is also preferably provided with a detent to hold the housing in selected operable positions on its rotatable mounting.