| 摘要 |
Disclosed is a semiconductor assembly and a method for the manufacture thereof. The assembly includes a wafer of semiconductive material that defines two substantially parallel major surfaces and contains a preselected distribution of conductivity altering impurities such that a plurality of semiconductor device pellets is formed. Metallic mounting plates are soldered to metallic contacts on one or both of the major surfaces. The assembly is best fabricated by utilizing solder clad metallic plates, properly positioning them adjacent the metallic contacts and then heating the assembly to form solder bonds between the plates and the wafer. An alternate method is disclosed in which solder clad plates are applied to individual semiconductor pellets. Shaker feed techniques are advantageously employed.
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