| 摘要 |
<p>The cooling system for several grouped circuit components, has cavities (3) inside its heat sink element containing liquid (4) that evaporates as the heat sink warms up and recondenses in a condenser outside the immediate vicinity of the heat sink. The liquid then flows back into the cavities in the heat sink. The heat sink has fins and webs to increase the surface area exposed to the ambient air. The components (5, 8) are mounted on the flat surface of the heat sink, immediately above the cavities containing the liquid. The advantage lies in the system's cheapness and in its accommodating new components.</p> |
