| 摘要 |
In a process for providing a uniformly thick adhesive coating on a surface of a structure which is to receive, over said adhesive coating, a conductive coating to form a circuit board, a surface of a carrier having a release agent thereon, is coated with an adhesive, which is dried at an elevated temperature prior to pressing the coated carrier on the structure and removing said carrier to leave the adhesive-coated structure. |
