Board inspection apparatus and method

摘要

An inspection method includes photographing a measurement target to acquire image data for each pixel of the measurement target, acquiring height data for each pixel of the measurement target, acquiring visibility data for each pixel of the measurement target, multiplying the acquired image data by at least one of the height data and the visibility data for each pixel to produce a result value, and setting a terminal area by using the produced result value. Thus, the terminal area may be accurately determined.

主权项

1. A board inspection apparatus comprising:
a stage transferring a board; a first illumination section illuminating a light for aligning the board onto an inspection target formed on the board; a projecting section projecting a grating pattern light for acquiring height data of the board onto the inspection target; a second illumination section illuminating a light for discriminating a terminal area of a component from a solder area that are formed on the board onto the inspection target; a third illumination section located nearer to the board than the second illumination section; an image photographing section photographing a first image of the board by light illumination of the second illumination section and photographing a second image of the board by grating pattern light illumination of the projecting section; and a control section discriminating the terminal area from the solder area by using the first image and the second image photographed by the image photographing section, wherein the second illumination section is disposed at an angle between a first angle at which the image photographing section is inclined and a second angle at which the projecting section is inclined, with respect to a normal line perpendicular to a flat plane of the board, and wherein the second illumination section illuminates the light at an angle ranging from the first angle to the second angle with respect to the normal line perpendicular to the flat plane of the board.