| 摘要 |
A desoldering system which operates in conjunction with a soldering instrument which may be of the temperature controlled type disclosed and claimed in applicant's prior U.S. Pat. No. 3,883,716. The desoldering tip is specifically designed for simultaneously desoldering dual-in-line integrated circuit packages, having for example 14 or 16 pins, multiple pins for transistors, 8 or 10 pin round integrated circuit packages and the like. Due to the large throughput of air required to the vacuum system the desoldering attachment features large inlet pipes. The desoldering tip is directly screwed onto the heating element of a soldering instrument surrounded by an air tight sleeve which includes a filter or trap for the solder. The sleeve of the desoldering instrument in turn is connected to another barrel which may include an additional filter and is provided with a three-way trigger valve. The valve selectively connects the desoldering attachment to a vacuum line to pull in the solder, it closes the vacuum line when not depressed, and provides access to the outside air for removing the solder collected in the desoldering attachment. A solder extractor is provided for this purpose. It is connected to a vacuum line and features a snap action to uncover a vacuum connection whereby the desoldering tip and its sleeve may be cleaned by sucking out the solder.
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