发明名称 Assembling method and maintaining method for vertical probe device
摘要 An assembling method for a vertical probe device includes steps of disposing a lower die on a jig by inserting supporting columns through jig holes of the lower die, fastening a positioning film on the supporting columns, installing probe needles and an upper die in a way that the positioning film is located between the upper and lower dies without contacting the upper die, unfastening the positioning film, and removing the jig so that the upper and lower dies, positioning film and probe needles constitute the device. A maintaining method for the device includes steps of inserting the supporting columns through the jig holes, fastening the positioning film to the jig, and removing the upper die. The probe needles and upper die are easily removed and installed and the probe needles are reliable. The vertical probe device is applicable for accommodating electronic components on the top thereof.
申请公布号 US9465050(B2) 申请公布日期 2016.10.11
申请号 US201514643780 申请日期 2015.03.10
申请人 MPI CORPORATION 发明人 Chen Tsung-Yi;Fan Horng-Kuang;Yang Ching-Hung;Lee Chung-Tse;Kuo Chia-Yuan;Li Tien-Chia;Wu Ting-Ju
分类号 G01R31/01;G01R3/00;G01R1/073;G01R31/26 主分类号 G01R31/01
代理机构 Muncy, Geissler, Olds & Lowe, P.C. 代理人 Muncy, Geissler, Olds & Lowe, P.C.
主权项 1. An assembling method for a vertical probe device, which comprises the steps of: a) providing a lower die having a plurality of needle holes and a plurality of jig holes, and a jig having an installing surface and a plurality of supporting columns each protruding over the installing surface and having a top surface; b) disposing the lower die on the installing surface of the jig in a way that the supporting columns of the jig are inserted through the jig holes of the lower die respectively; c) disposing a positioning film on the top surfaces of the supporting columns; d) fastening the positioning film to the jig by fastening elements; e) installing a plurality of probe needles in a way that the probe needles pass through the positioning film and are inserted through the needle holes of the lower die respectively; f) fastening an upper die having a plurality of needle holes on the lower die in a way that the positioning film is located between the upper die and the lower die without contacting the upper die, and the probe needles are inserted through the needle holes of the upper die respectively; g) removing the fastening elements; and h) separating the jig from the lower die so that the vertical probe device is formed as a combination of the lower die, the positioning film, the probe needles and the upper die.
地址 Chu-Pei, Hsinchu Shien TW