发明名称 SPUTTERING TARGET
摘要 Provided is a sputtering target equipped with a flat part and a taper part, wherein the sputtering target is characterized in that a machined groove for use in ignition is positioned on the sputtering surface of the target. It is possible to lower the lighting failure rate during ignition (plasma lighting), and initiate the sputtering process consistently. In so doing, downtime of the device can be shortened, contributing to improved throughput and enhanced cost performance.
申请公布号 WO2016186119(A1) 申请公布日期 2016.11.24
申请号 WO2016JP64667 申请日期 2016.05.18
申请人 JX NIPPON MINING & METALS CORPORATION 发明人 Murata Shuhei;YAMAKOSHI Yasuhiro;NAGATSU Kotaro
分类号 C23C14/34;H05H1/46 主分类号 C23C14/34
代理机构 代理人
主权项
地址