发明名称 HYBRID INTEGRATED CIRCUIT
摘要 PURPOSE:To upgrade adhesiveness and airtightness, by providing the following parts: a resin injection part which is opened in an L shape ranging from a side of the susceptor to its surface, an L-shaped lead which is connected with a circuit on a ceramic substrate, first resin which is transferred/molded into the resin injection part, and a second resin which is formed on the resin injection part on the ceramic substrate side. CONSTITUTION:There are provided the following parts: a resin injection part 11 which is opened in an L shape ranging from a side 14 of a susceptor 1 to its surface 15, an L-shaped lead 2 which is connected with a circuit on a ceramic substrate 4, first resin 16 which is transferred/molded into the resin injection part 11, and second resin 17 which is formed on the resin injection part 11 on the ceramic substrate 4 side. When resin is injected into the resin injection part 11, the forming of the lead 2 shaped in L functions to enlarge an adhesion area, so that strength against force for the drawing of the lead 2 and up-and- down/right-and-left force can be increased. Since a path of an adhesion part between the resin 11 and the lead 2 is long, penetration of moisture, contaminating gases, and the like can be prevented further.
申请公布号 JPS63284839(A) 申请公布日期 1988.11.22
申请号 JP19870119907 申请日期 1987.05.15
申请人 SANYO ELECTRIC CO LTD 发明人 MORIMURA YUKIO;NOZAKI TSUTOMU;SAKURAI TOSHIO
分类号 H01L23/02;H01L23/50 主分类号 H01L23/02
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