发明名称 Method of manufacturing a compact switch
摘要 A method of manufacturing a compact switch includes steps of (a) forming a base by insert molding on terminal members such that terminal pins of the terminal members are extended downward through the base when the terminal members, one of which has a bimetallic plate-fixing portion and another of which has engaging grooves to be engaged with a movable spring member, are punched in a hoop member; (b) fixing a bimetallic plate to the fixing portion of the one terminal member, a fixed contact being attached to a free end of the bimetallic plate which is displaced when temperature of the bimetallic plate is raised; (c) bringing a movable spring member into engagement with the engaging grooves of the other terminal member, a movable contact to be faced to the fixed contact being attached to a free end of the movable spring member; (d) bringing a lower end portion of a push button member into engagement with the movable spring member; (e) cutting the terminal pins at predetermined positions from a lead frame of the hoop member and accommodating in a hosing a switch unit thus formed by the steps (a) to (d) to enable automated manufacturing process of the compact switch.
申请公布号 US4860436(A) 申请公布日期 1989.08.29
申请号 US19870130579 申请日期 1987.12.09
申请人 501 IDEC IZUMI CORPORATION 发明人 HIRABAYASHI, MICHIO;KOIZUMI, TOSIO;SHIBAO, KIYOTADA
分类号 H01H11/00;H01H13/12;H01H13/36;H01H13/42;H01H73/30 主分类号 H01H11/00
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