SOLID IMAGE SENSING DEVICE WITH CUTTING LAYER USING POLYSILICON

摘要

The manufacturing process of the CCD with a cutting layer using the polysilicon has the following steps of : (a) forming a P well (2) and P well (3) by implanting the boron on the n-type silicon substrate (1); (b) depositing a metal film after forming a channel stop region (6) and a photodiode (8), burried channel and the first, second polysilicon in sequence ; (c) forming a insulated layer between the photocells by etching the polysilicon (10) deposited on SiO2 layer after forming the channel stop region (6).