发明名称 |
High performance test head and method of making |
摘要 |
A high performance test head (18) communicates test signals between integrated circuit test pads and integrated circuit tester. Test head (18) comprises metal bumps (22) that electrically couple with test pads to communicate test signals between test pads and test circuitry. Planar foundation plate (30) provides structural support. Compliant material layer (26) associates with metal bumps (22) and compresses to assure positive contact between metal bumps (22) and test pads. Compliant material layer (26) is positioned between foundation plate (30) and metal bumps (22). Interconnection line (20) adjoins test head (18) to connect metal bumps (22) between test circuitry and integrated circuits. The present invention includes a method for high performance communication of test signals between test pads and test circuitry. The present invention further includes the method of applying semiconductor device fabrication techniques to produce a high performance test head (18).
|
申请公布号 |
US5090118(A) |
申请公布日期 |
1992.02.25 |
申请号 |
US19900560398 |
申请日期 |
1990.07.31 |
申请人 |
TEXAS INSTRUMENTS INCORPORATED |
发明人 |
KWON, ON-KYONG;HASHIMOTO, MASASHI;MALHI, SATWINDER |
分类号 |
G01R1/073;G01R31/28;H01R12/04 |
主分类号 |
G01R1/073 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|