| 摘要 |
PURPOSE:To obtain a board for mounting a semiconductor device, in which the device can be directly mounted without impairing a high speed of the device. CONSTITUTION:In a board 200 for mounting a semiconductor device, in which a signal transmission line 210 is formed, a bump electrode 300 is interposed between the line 210 and an electrode pad of the device 100 to directly mount the device 100, a part directly under the device 100 is cut out to form an opening 220. |
