Multilayer metallic printed circuit board and a cast component

摘要

A metallic printed circuit board is formed by lamination of an insulation layer on the surface of a metallic plate as a base, and electronic parts are subsequently mounted on the conductor arrangement which is formed on the surface of the insulation layer. A double-sided printed circuit board having electronic parts mounted on it is arranged parallel thereto. The two printed circuit boards are monolithically supported and fastened by filling the space between the printed circuit boards with an insulating resin, and subsequently curing the resin. Furthermore, an insulating resin is laminated onto the surface of the printed circuit board in such a manner that the resin can cover the fitted electronic parts, and is subsequently cured. The heat which is produced by the electronic parts can effectively be transmitted to the insulating resins by using a resin having a high thermal conductivity for both of the insulation resins, and the heat is then emitted from the surfaces of the metallic plate or of the insulating resin.