Process for manufacturing a multi-chip module

摘要

A multi-chip module and a process for manufacturing the same comprises at least first and second semiconductor chips each formed with a plurality of semiconductor elements on their circuit forming surfaces and having different functions, mounted on a substrate. An insulating film is formed over the circuit forming surfaces of the first and second semiconductor chips. First and second connecting holes are formed in the insulating film over the circuit forming surfaces of the first and second semiconductor chips, respectively. A wiring layer is formed across the first and second connection holes so as to connect the first and second semiconductor chips electrically.