Planar passivation for pads

摘要

Devices and methods for forming a device are presented. The method includes providing a substrate having circuit component and a dielectric layer over the substrate. The dielectric layer includes a plurality of inter level dielectric (ILD) layers and the uppermost dielectric layer includes at least one interconnect. A pad dielectric layer is provided over the uppermost ILD layer. A pad interconnect for receiving a wire bond is formed in the pad dielectric layer. The pad interconnect is coupled to the at least one interconnect of the uppermost ILD layer. A top surface of the pad dielectric layer is substantially coplanar with a top surface of the pad interconnect. A passivation layer is formed over the pad dielectric layer.

主权项

1. A device comprising:
a substrate having circuit component and a dielectric layer over the substrate, wherein the dielectric layer comprises a plurality of inter level dielectric (ILD) layers and the uppermost dielectric layer comprises at least one interconnect; a pad dielectric layer which comprises a flowable dielectric material disposed over the uppermost ILD layer; a pad interconnect which is a wire bond pad configured for receiving a wire bond disposed in the pad dielectric layer and a top surface of the pad interconnect is exposed such that the wire bond is to be attached and in direct contact thereto, wherein the pad interconnect is coupled to the at least one interconnect of the uppermost ILD layer, wherein a top surface of the pad dielectric layer is substantially coplanar with a top surface of the pad interconnect; and a passivation layer disposed over and in direct contact with the pad dielectric layer, wherein the passivation layer comprises a non-planar top surface having a first height closer to the pad interconnect and a second height away from the pad interconnect, wherein the first height is slightly higher than the second height, and the passivation layer is used for preventing a top surface of the pad interconnect from oxidation/corrosion and contamination during wire bonding and packaging process.