| 摘要 |
An electronic device with an EMI shield surrounding an electronic component on a substrate. A heat sink extends through an opening in the shield from heat conductive contact with the component to a position outside the shield. The heat sink operates also in an EMI shield capacity. The shield is stressed to hold the heat sink positively in heat conducting contact with the components. The shield preferably has cutting teeth which cut into the heat sink as the latter is passed into the aperture. With the inserted part of the heat sink being cylindrical, rotation of the heat sink causes the teeth to move up the inserted part to stress the shield and urge the heat sink against the component. |
