| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a highly reliable surface mount electronic part, which is suitable for a large current, which can be manufactured at low cost by simplifying the structure of a ceramic package without using wire bonding, and provide further its manufacturing method. SOLUTION: An intermediate insulating board 22, on which a through hole 21 is provided almost in the center of the main surface, and the electronic part such as a semiconductor pellet 23 to be housed in the through hole of the insulating board, are fixed to the side of both main surfaces of the intermediate insulating board 22, a pair of external insulating boards 24 and 25, having conductive layers 26a and 26b provided in such a manner that it come in contact with the electronic part, are provided, the conductive layers 26a and 26b are extended to the edge part of the external insulating boards 24 and 25, and a metal electrode is formed on both ends of the external insulating boards 24 and 25. For forming the surface mounting electronic part 20 for one unit, a laminated body, in which an intermediate insulating aggregate plate and an external insulating aggregate plate are used, is formed and it is individually divided.</p> |
