| 摘要 |
PROBLEM TO BE SOLVED: To obtain a multilayered printed circuit board free form voids and excellent in surface smoothness. SOLUTION: This interlaminar insulating adhesive for multilayered printed circuit board comprises as essential components a bisphenol epoxy resin having a weight-average mol.wt. of 10,000 or higher, a bisphenol epoxy resin having an epoxy equivalent of 500 or lower, and an acid anhydride hardener. The hardener preferably consists of at least one member selected form among methyltetrahydrophthalic anhydride, methylendomethylenetetrahydrophthalic anhydride, methylbutenyltetrahydrophtalic anhydride, hexahydrophthalic anhydride, and methylhexahydrophthalic anhydride. |
