METHOD OF POSITIONING WAFER ORIENTATION FLAT, WAFER CHUCK, AND SEMICONDUCTOR MANUFACTURING/TESTING APPARATUS

摘要

PROBLEM TO BE SOLVED: To accurately position the orientation flat by pressing a wafer to a positioning mechanism attached to a wafer chuck. SOLUTION: At positioning of the orientation flat 20a by pressing a wafer 20 to a positioning mechanism 32 attached to a wafer chuck 30, a mounting face 38 is inclined enough to move the wafer 20 to the positioning mechanism 32 due to its self wt., thus positioning its orientation flat 20a.