SUBSTRATE TREATING APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a substrate treating apparatus which prevents a wafer from releasing holding claws and causes no damage to the wafer. SOLUTION: The apparatus for treating a wafer W by jetting a treating liq. vertically on the center of the wafer from below has claws 24 for holding the wafer W. The claw has a chuck face 83a approximately vertically rising to a set face 82a and re-positioning face 83b. The chuck face has protrusions 86 at the upper side. To chuck the wafer, the chuck face 86a is contacted to the wafer. To release to from the chuck, the claws 24 are rotated to face the re-positioning face 83b at the wafer. The treatment is made while the wafer is being chucked. The wafer may float up due to the flow of a chemical liq. but the floating is regulated by the protrusions 86.