Monolithic ceramic electronic component

摘要

Outer electrodes include end-surface outer electrodes arranged on end surfaces of a ceramic multilayer body, and side-surface outer electrodes on side surfaces of the ceramic multilayer body, the side-surface outer electrodes being electrically connected to the end-surface outer electrodes. Sputtered electrode layers of the side-surface outer electrodes in contact with the ceramic multilayer body are composed of a material containing a metal with a standard redox potential of about −2.36 V to about −0.74 V, the proportion of the metal in the material being about 3% by mass or more. Sputtered outermost electrode layers serving as the outermost layers of the side-surface outer electrodes are composed of a metal or an alloy in which the heat of solution of hydrogen is about 23.8 kJ/molH or more.

主权项

1. A monolithic ceramic electronic component having a structure comprising:
a ceramic multilayer body including
stacked ceramic layers, andinner electrodes arranged between adjacent ceramic layers of the stacked ceramic layers; a first outer electrode arranged on the ceramic multilayer body, the first outer electrode being electrically connected to a first plurality of the inner electrodes; and a second outer electrode arranged on the ceramic multilayer body, the second outer electrode being electrically connected to a second plurality of the inner electrodes, wherein (a) the first and second outer electrodes each include an end-surface outer electrode arranged on an end surface of the ceramic multilayer body, and a side-surface outer electrode on side surfaces in contact with the end surface of the ceramic multilayer body, the side-surface outer electrode being electrically connected to the end-surface outer electrode, and (b) the side-surface outer electrode includes a first sputtered electrode layer and a second sputtered electrode layer, the first sputtered electrode layer contacting the ceramic multilayer body and including a material containing a first metal with a standard redox potential of about −2.36 V to about −0.74 V, a proportion of the first metal in the material being about 3% by mass or more, the second sputtered electrode layer including a second metal or an alloy in which a heat of solution of hydrogen is about 23.8 kJ/molH or more, the first sputtered electrode layer including a material that is different from a material of the end-surface outer electrode, and the side-surface outer electrode only overlaps an edge of the end-surface outer electrode.