MANUFACTURE OF MULTILAYER CIRCUIT BOARD AND PRE-PREG USED FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To suppress the generation of a void at the time of using a pre-preg for adhesion using a para system aromatic polyamide fiber non-woven cloth as a base material in the manufacture of a multilayer circuit board. SOLUTION: The resin percentage content in a pre-preg for adhesion in made 40-65% by weight, and the minimum fusing viscosity of included and dried resin is made 100-10000 poise. A pre-preg for adhesion is interposed between a circuit board for an inner layer and a metallic foil being the circuit of a surface, and they are integrated by heated press molding. The base material of the pre-preg for adhesion is the mixed non-woven cloth of a para system aromatic polyamide fiber and a thermoplastic resin fiber at more than 220 deg.C, and both fibers are bound by a thermosetting resin binder so that the thermoplastic resin fibers can be mutually thermally fused, or the thermoplastic resin fiber can be thermally fused with the para system aromatic polyamide fiber. It is preferred that the extracted water permeability of a base material constituted of the para system aromatic polyamide fiber non-woven cloth is set less than 100μS/cm.