| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor accelerometer, in which the deviation between a semiconductor accelerometer chip and a stopper is reduced and whose temperature characteristic is good. SOLUTION: In a semiconductor accelerometer constituted of a flexure part 1 which is composed of the central part 1a and a beam part 1b which is formed to extend in all the directions from the outer peripheral edge of the central part 1a, a plumb hob part 2b which is suspended from, and supported by the central part 1a via a neck part 2a is provided, a frame 3 which is formed in such a way that the beam part 1b is connected to the inner peripheral side face, and a support member 5 which supports the rear surface of the frame 3 and which surrounds the outer peripheral edge of the plumb hob part 2a via a cutout part 4 are provided. In addition, a piezoresistance 6 is formed at a prescribed place on the beam part 1b, and an interconnection 10 is formed so as to be connected electrically to the piezoresistance 6. In addition, a cut-out groove 7, which extends to the neck part 2a from the outer peripheral edge of the plumb hob part 2b, is formed between the beam part 1b and the plumb hob part 2b. Thereby, a semiconductor accelerometer chip is constituted. Then, a lower-part stopper 8 in which a recessed part 8a is formed in a place corresponding to the plumb hob part 2b is bonded to the rear surface of the semiconductor accelerometer chip, i.e., the support member 5. At this time, a cross-shaped groove part 9 is formed on the rear face of the lower-part stopper 8.</p> |
