| 摘要 |
<p>PROBLEM TO BE SOLVED: To carry out repair within a very short time that can keep the dimensional accuracy of a thick film pattern without causing new disconnection. SOLUTION: This repair method of a disconnected part in a thick film pattern 2 formed on a board 1 by burning down an organic component in paste by baking the entire board on which a pattern is formed in a thick film form, applies an appropriate quantity of a repair paste 4, having a melting temperature lower than that of the paste used in patterning the thick film pattern 2, to the disconnected part and thereafter burns down the organic component in the repair paste 4 by irradiating a laser beam to an irradiation region having an area to cover the repair paste 4. Thereby, the repair can be performed within a period shorter than is required by using the same paste as the paste used in forming the thick film pattern.</p> |
