| 摘要 |
PROBLEM TO BE SOLVED: To provide a method suitable for effectively manufacturing a fine laminated wiring board and a wiring board with bumps of high density. SOLUTION: A wiring pattern 6 is formed on either of two wiring boards 11 that are laminated together, metal foil pieces 15 blanked out of a low-melting metal foil 14 by a punching machine 12 are temporarily fixed at prescribed positions on the wiring pattern 6, and the metal foil pieces 15 are melted by heating into spherical bodies 16 due to surface tension when they are melted. After the spherical bodies 16 are cooled down, an adhesive layer 17 is formed on the wiring pattern 6, the other wiring board 11 is laminated thereon, and the wiring boards 11 and 11' are thermocompressed into a laminate of integral structure. As a result, the wiring boards 11 and 11' are formed into a laminate of integral structure where the wiring patterns 6 and 10' are electrically connected together through the spherical bodies 16, whereby a prescribed laminated wiring board can be obtained. If manufacturing processes are finished at a stage where the spherical bodies 16 are formed, a wiring board with bumps where the spherical bodies 16 serve as electrode bumps can be provided. |
