| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method of manufacturing a circuit board which enables a preliminary solder pattern to be formed easily and precisely, on a fine-pitch pad and a suitable material of the circuit board using the method. SOLUTION: A method of manufacturing a circuit board comprises a step of forming single-layer or multilayer wiring patterns 22, 24, etc., electrically connected with a metal layer 12 on the side of an insulating resin layer 16 of a board material 10, wherein a solder layer 14 is formed on one surface of the metal layer 12 and the insulating resin layer 16 is formed on the other surface of the metal layer 12, and a step of etching the solder layer 14 and the metal layer 12 to form a pad pattern 28, wherein solder 14a coats a pad 12a formed of the metal layer 12. |
