| 摘要 |
PROBLEM TO BE SOLVED: To improve heat dissipating performance and reduce manufacturing cost with a heat sink consisting a part of a wall of a duct and no gap, by easily and positively installing a CPU and the heat sink on the side wall of a duct disposed in the housing of an electronic apparatus. SOLUTION: A heat dissipating device for an electronic apparatus is provided with a heat sink 10 connected to a CPU 2, frame member 20 for installing thereof, and a square cylindrical duct 30. The frame member 20 is fitted in the heat sink 10, engaging projections 25 and 25 of the frame member 20 are pressed inside and deformed so as to close the both right and left ends of recessed grooves 13 of the heat dissipating substrate 11 to connect the heat sink 10 with the frame member 20, the heat sink 10 and the frame member 20 are fitted with an opening face 31 on the top side face of the square cylindrical duct 30 with the heat dissipating fins 12 inside the duct 30, and engaging hooks 24 of the frame member 20 are engaged with engaging holes 34 of the duct 30. Thus, the heat sink is fixed on the duct 30 via the frame member 20.
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