发明名称 PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To utilize the self-alignment function of a solder when a chip type electronic part is attached to the land of a printed wiring board. SOLUTION: Each land 10 of a printed wiring board 30 comprises a rectangular part 10A of such length and width as corresponding to an electrode and a protruding part 10B extending outside the rectangular part. The distance between outer edges of the protruding parts 10B of the two lands is larger than the dimension in lengthwise direction of a chip type electronic part 20 while the distance between inner edges of the rectangular parts 10A of the two lands is equal to that between inner edges of two electrodes of the chip type electronic part 20.
申请公布号 JP2001057467(A) 申请公布日期 2001.02.27
申请号 JP19990231650 申请日期 1999.08.18
申请人 SONY CORP 发明人 ODA KUNIO;WATANABE NORIAKI;MINAMIZAWA OSAMU
分类号 H05K3/34;(IPC1-7):H05K3/34 主分类号 H05K3/34
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