Modul innefattande ett eller flera chip

摘要

A module comprising one or more chips and a carrier. The invention is characterised in that the carrier (6) supports a conductive layer (7) that includes a number of conductors; in that chips (2-5; 10; 27-30) are mounted directly on conductive layer (7) of the carrier (6); in that said chips (2-5; 10, 27-30) are connected electrically directly to the conductor system (7); and in that the carrier-supported conductive layer includes terminals (8,9) in the form of solder balls or corresponding devices disposed on the same side of the carrier (6) as said chips.