| 发明名称 |
Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures |
| 摘要 |
Contact structures exhibiting resilience or compliance for a variety of electronic components are formed by bonding a free end of a wire to a substrate, configuring the wire into a wire stem having a springable shape, severing the wire stem, and overcoating the wire stem with at least one layer of a material chosen primarily for its structural (resiliency, compliance) characteristics.
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| 申请公布号 |
US2001020545(A1) |
申请公布日期 |
2001.09.13 |
| 申请号 |
US20000747118 |
申请日期 |
2000.12.22 |
| 申请人 |
FORMFACTOR, INC. |
发明人 |
ELDRIDGE BENJAMIN N.;GRUBE GARY W.;KHANDROS IGOR Y.;MATHIEU GAETAN L. |
| 分类号 |
B23K20/00;C23C18/16;C25D5/08;C25D5/22;C25D7/12;C25D21/02;G01R1/04;G01R1/067;G01R1/073;G01R31/28;H01L21/00;H01L21/48;H01L21/56;H01L21/60;H01L21/603;H01L21/66;H01L23/48;H01L23/485;H01L23/49;H01L23/498;H01L25/065;H01L25/16;H05K1/14;H05K3/20;H05K3/30;H05K3/32;H05K3/34;H05K3/36;H05K3/40;H05K7/10;(IPC1-7):H05K1/16;H05K7/20 |
主分类号 |
B23K20/00 |
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