发明名称 |
Method and apparatus for detecting a planarized outer layer of a semiconductor wafer with a confocal optical system |
摘要 |
A method of planarizing a first side of a semiconductor wafer with a polishing system includes the step of polishing the first side of the wafer in order to remove material from the wafer. The method also includes the step of moving a lens of a confocal optical system between a number of lens positions so as to maintain focus on the first side of the wafer during the polishing step. The method further includes the step of determining a rate-of-movement value based on movement of the lens during the moving step. Moreover, the method includes the step of stopping the polishing step if the rate-of-movement value has a predetermined relationship with a movement threshold value. An apparatus for polishing a first side of a semiconductor wafer is also disclosed.
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申请公布号 |
US2001021622(A1) |
申请公布日期 |
2001.09.13 |
申请号 |
US20010754429 |
申请日期 |
2001.01.04 |
申请人 |
ALLMAN DERRYL D.J.;DANIEL DAVID W.;GREGORY JOHN W. |
发明人 |
ALLMAN DERRYL D.J.;DANIEL DAVID W.;GREGORY JOHN W. |
分类号 |
B24B37/04;B24B49/04;B24B49/12;H01L21/00;(IPC1-7):B24B49/00;B24B51/00 |
主分类号 |
B24B37/04 |
代理机构 |
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地址 |
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