发明名称 LOW TEMPERATURE-BURNED CERAMIC COMPOSITION AND WIRING BOARD USING IT
摘要 PROBLEM TO BE SOLVED: To provide a method for manufacturing a low temperature-baked ceramic composition from nonglass raw material that is compacted in temperature <=1,000 deg.C and shows a stable low dielectric constant and a low dielectric loss, and to provide a wiring board using the composition. SOLUTION: The ceramic composition mainly contains a diopsied crystal. An insulation layer for the wiring board preferably is provided with the properties: dielectric constantε<=7;Q×f value >=10,000 GHz. The composition preferably contains SiO2-like crystal, a wollastonite crystal and/or an enstatite crystal as a subsidiary crystal.
申请公布号 JP2001278657(A) 申请公布日期 2001.10.10
申请号 JP20000187107 申请日期 2000.06.22
申请人 NGK SPARK PLUG CO LTD 发明人 MIZUTANI HIDETOSHI;SUZUMURA SHINJI;IIO SATOSHI
分类号 C04B35/22;C04B35/20;H05K1/03;H05K3/46;(IPC1-7):C04B35/22 主分类号 C04B35/22
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