| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition, for sealing an optical semiconductor, excellent in transparency and solder resistance and an optical semiconductor device sealed with a cured product thereof. SOLUTION: The epoxy resin composition for sealing an optical semiconductor comprises as essential ingredients, a bisphenol A type epoxy resin (a), a polyfunctional alicyclic epoxy resin (b), an aliphatic acid anhydride curing agent (c), a filler (d), an antioxidant (e) and a curing accelerator (f), where the component (d), the filler, comprises glass particles mainly composed of SiO2, CaO and Al2O3, and the difference between the refractive index of a cured product of a composition composed of the ingredients other than the component (d) and that of the filler (d) is 0.01 or less.
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