| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a multilayer wiring board, having not only rigidity but also superior heat dissipation characteristic and noise characteristic. SOLUTION: The method for manufacturing a multilayer wiring board comprises a step for forming a resist metal layer and a wiring pattern, using a metal plate as a lead for electrolytic plating; a step for removing the metal plate by etching, and a step for forming a metal frame 116 on the outermost layer of the multilayer wiring board 113 partially etching and removing a metal plate 101b which is used at formation of the outermost layer on the side of the multilayer wiring board 113, for mounting of a semiconductor chip 202.</p> |
