| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for picking up only chip-shaped component which prevents the chip-shaped components from being broken and scattered and can exactly pick up the purposed chip-shaped component only along with prevention of chiplike materials from breakage and scattering. SOLUTION: In the peeling method of chip-shaped components, a step that the chip-shaped components are put in a state such that the components are pasted on an adhesive sheet, which consists of a thermally deformable base material and an energy line-cured adhesive layer provided on at least one surface of the base material, in alignment with the adhesive layer without cutting the base material, and a step that the energy lines are irradiated on the adhesive layer are performed. Thereafter, the base material is partially heated and the chip-shaped component being pasted on the partially heated place of the base material is peeled off from the base material.</p> |
