| 摘要 |
PURPOSE: To reduce the cost of a board mounted with a semiconductor integrated circuit device by effectively using an insulation board. CONSTITUTION: When a plurality of output test terminals 8 corresponding to a plurality of output lead part 6 are made one block, a pair of the output test terminals 8 corresponding to each output lead part 6 of both outward sides are provided in the arrangement of the output lead parts 6 in the block, formed so as to be extended to an inward side in the arrangement of the output lead part 6 from the output lead part 6 so that the pair of the test terminals are opposed, and the output test terminal 8 making the pair is formed at a relatively remote position from the mounting position of a liquid driver LSI chip 1. |
