| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor chip where cracks can be prevented and connection reliability can be secured, and to provide its manufacturing method. SOLUTION: A resin insulating layer 250 having a coefficient of linear thermal expansion of 10-70 ppm/ deg.C is used. Because the coefficient of linear thermal expansion is small, even if subjected to heat cycles repeatedly, large stress due to the difference in the coefficient of thermal expansion with regard to an external board 210 does not occur. In addition, because the resin insulating layer 250 consisting of an insulating board of high strength is arranged, even if stress from the side wall of a copper plating post 250 act in a horizontal direction by the difference between coefficients of linear thermal expansion of an IC chip 20 and the external board 210, the cracks do not occur in the resin insulating layer 250 and disconnection does not occur therein.</p> |
