| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide equipment for peeling a wafer protective tape and wafer mounting equipment that cause no wreck or damage because of floating or wrap at the time of peeling process or mounting process, in addition, it is possible to apply without changing sucking tables according to the sizes of wafers such as eight inch and twelve inch wafers, while the devices have simple structure and is compact, and excellent in versatility. SOLUTION: When the smallest size of the wafer transcription F is under peeling process, a supporting ring table 20 goes down and performs peeling process by mounting and sucking the wafer part W of the smallest size of the wafer transcription F on a center suction table 20. When the wafer transcription F larger than the smallest size thereof is under peeling process, the supporting ring table 50 goes up and performs peeling process by mounting and sucking the wafer part W of the wafer transcription F, and also it is formed to support an outer round of the wafer W of the wafer transcription F with the supporting ring table 20.</p> |
