| 摘要 |
PROBLEM TO BE SOLVED: To provide a measuring instrument capable of measuring the thickness of the thin film formed on a substrate such as a semiconductor substrate or the like. SOLUTION: The measuring instrument is equipped with a heating part 50 for applying strain (heat) to the point A of the surface of the substrate W to propagate the same to the point B of the surface of the substrate W, a measuring part 60 for measuring the surface displacement of the substrate W at the point B to which the strain is propagated and a control/analyzing part 70 for analyzing the thickness of the thin film formed on the substrate on the basis of the distance between the point A and the point B from the displacement measured by the measuring part 60.
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