| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for manufacturing a semiconductor capable of suitably achieving desired processing of a substrate without damaging the substrate. <P>SOLUTION: This apparatus for manufacturing the semiconductor comprises within a processing chamber, wherein the substrate consisting of a material for an electronic device is processed, an annular clamp 3, a plurality of claw members 2 provided on the inner peripheral part of the clamp 3 for supporting the peripheral part of the substrate 1, a substrate stage located above and facing the clamp 3 for processing the substrate 1, and a drive mechanism consisting of a cylinder and a shaft for driving the clamp 3 to press the substrate 1 against the substrate stage 4 via the claw members 2, when the substrate 1 is processed. At least the part of the claw member 2 which supports the substrate 1 is constructed of an elastic body consisting of a leaf spring member 2a, and the claw member 2 has an inclined part 2f facing the substrate edge and inclined upwardly at the outer side of the substrate edge. <P>COPYRIGHT: (C)2003,JPO</p> |
