| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive film for a semiconductor which has sufficient adhesive force for a lead frame, can be easily peeled off after resin sealing, and has various characteristics required for a semiconductor. SOLUTION: In the adhesive film used for the method in which the adhesive film is attached on the backside of a lead frame to protect the surface and the film is peeled off after sealing, a resin layer A is formed on the single surface or both surfaces of a supporting film, and the supporting film is surface- treated. COPYRIGHT: (C)2003,JPO
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