| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer board which secures the interlayer connection, and to provide a highly reliable multilayer wiring board manufactured by the manufacturing method. SOLUTION: The method of manufacturing a multilayer board comprises a tentative contact bonding step in which after a wiring pattern, a conductor post 101, a connection layer having a solder layer 102 on the end surface of the conductor post 101, and a layer to be connected having a land 103 for interlayer connection with the conductive post 101, are aligned. They are heated to the temperature that melts the adhesive agent 106 in a vacuum atmosphere, and a regular contact bonding step in which after the solder layer 102 is melted being heated to a melting point or over, at which the solder layer 102 is formed, pressure is applied to connect the solder layer 102 with the land 103 for interlayer connection. The multilayer wiring board is manufactured by the above method. COPYRIGHT: (C)2004,JPO |
