| 发明名称 |
SUBSTRATE FOR AN ELECTRIC COMPONENT AND METHOD FOR THE PRODUCTION THEREOF |
| 摘要 |
For a component mounted with the flip-chip technique, in particular surface wave elements, it is proposed to use a low-shrinkage ceramic substrate over which (as needed) multi-layer metallizations are produced by metal deposition. The bumps can also be produced by self-aligning metal deposition. |
| 申请公布号 |
EP1356518(A2) |
申请公布日期 |
2003.10.29 |
| 申请号 |
EP20020701213 |
申请日期 |
2002.01.21 |
| 申请人 |
EPCOS AG |
发明人 |
FEIERTAG, GREGOR;STELZL, ALOIS;KRUEGER, HANS |
| 分类号 |
H01L23/12;H01L21/60;H01L23/498;H03H3/08;H03H9/10;H03H9/145;H03H9/25;H05K1/03;H05K1/11 |
主分类号 |
H01L23/12 |
| 代理机构 |
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