MARK RECOGNIZING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND PACKAGING METHOD

摘要

PROBLEM TO BE SOLVED: To recognize an image of a recognition mark which is formed on the circuit pattern formation side of a silicon wafer from the back thereof. SOLUTION: Back grinding is performed until the thickness of a silicon wafer 1 becomes 5-50μm. The side of the silicon wafer 1 formed with a circuit pattern 2 is irradiated with white light or visible light of a wavelength of≤800 nm, the visible light transmitted through the silicon wafer 1 is received by a visible light camera 3 from the back side of the silicon wafer 1, and the image of the recognition mark formed on the circuit pattern formation side of the silicon wafer 1 is recognized. COPYRIGHT: (C)2004,JPO