| 摘要 |
The invention relates a method for producing a multilayer circuit board ( 50 ) for a semiconductor device, comprising using a composite metal sheet ( 14 ) in which two metal sheets are combined, forming, on each side of the composite metal sheet, pads for connecting to a semiconductor element, the pads being made of a metal material which is substantially not etched by an etchant for the metal sheet, and an insulating layer having openings exposing the pads, forming, on the insulating layer, a wiring line layer ( 26 ) connected to the pads and having pads for connecting to another wiring line layer to be subsequently formed, subsequently fabricating a multilayer circuit board body ( 20 ) by necessary numbers of insulating layers and wiring line layers alternately formed, forming, on the outermost insulating layer of the multilayer circuit board body, an insulating layer provided with through-holes exposing pads for external connecting terminals, which are located on the outermost insulating layer, then dividing the composite metal sheet, to yield intermediates ( 34 ) each provided on one side of the metal sheet with the multilayer circuit board body, and etching the metal sheet at an area at which a semiconductor element is to be mounted to remove the material of the metal sheet at that area, to thereby form a frame ( 10 ) surrounding the area for the mounting of the semiconductor element. |
