发明名称 |
Method for producing carrier elements for semiconductor chips |
摘要 |
A carrier element for a semiconductor chip (23), in particular for mounting in chip cards, has a substrate (15) that carries the chip (23) and a reinforcing foil (10) laminated on the side of the substrate (15) that carries the chip (23). The reinforcing foil (10) has a recess (14) for receiving the chip (23) and its connection lines (24), whose edge is provided with a frame (12) that forms a single piece with the foil (10). |
申请公布号 |
IN192422(B) |
申请公布日期 |
2004.04.24 |
申请号 |
IN1123CA1997 |
申请日期 |
1997.06.13 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HUBER MICHAEL;STAMPRA PETER;HOUDEAU, DETLEF, DR.;FISCHER JUERGEN;HEITZER JOSEF;GRAF HELMUT |
分类号 |
G06K19/077;H01L23/12;H01L23/16;H01L23/24;H01L23/28;H01L23/498 |
主分类号 |
G06K19/077 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|