| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component packaging device and an electronic component packaging method which can reduce a tact time by eliminating a dead time in image picking-up operation by a line camera. <P>SOLUTION: In packaging an electronic component packaged in a substrate 3 by moving a transfer head 8 wherein an electronic component is unloaded from a component supply part 4, recognition operation data comprising position data of operation starting points PS1, PS2 and operation end points PE1, PE2 of movement operation for image picking-up are operated based on size data of the electronic component for each component kind in the image picking-up of the electronic component by a line camera 9, and a transfer head movement mechanism is controlled based on the recognition operation data in image picking-up. Consequently, a tact time can be reduced by eliminating a dead time in image picking-up operation by the line camera 9 by minimizing scan distances D1, D2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
