| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a packaging substrate wherein face down bonding of high reliability is enabled. <P>SOLUTION: In the packaging substrate wherein an IC chip is electrically and mechanically bonded to circuit terminals by face down bonding using bumps, a plurality of bolsters which make a gap between the IC chip and the packaging substrate constant are arranged on the surface of the packaging substrate. As a result, a gap between the chip and the substrate is made constant, and load to a plurality of the bumps are equalized, so that reliability of face down bonding is improved. Moreover, a vessel body which forms a front side mounted oscillator is used as the packaging substrate. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
